SURFACE MOUNTING TECHNOLOGY (SMT) PRODUCTION LINE
 
CURRENT CAPABILITY

PCB Board Size

 

: Min. (L)   50 x (W)   50 x (t) 0.4 mm

  Max. (L) 680 x (W) 460 x (t) 5.0 mm

 

Connectors

 

: Leg Pitch 0.3 mm

 

Chip Size

 

: Minimum size 0402 mm

 

IC Package

 

: Minimum pitch QFP 0.4 mm

                                    CSP 0.3 mm

                                    FPBGA 0.3 mm

 

Special Component Thickness

: Maximum 25 mm

 

SMT capacity

 

: 300,000,000 points / month

 

Inspection

 

: 3D Solder Paste Inspection (SPI-2000)

   Automatic Optical Inspection (Hurricane / Saki)

   X-Ray Inspection (SMX-1000)

   ROHS XRF Analyzer (EDX-720)

   In-circuit Test (Focus-2000)

   Drop test / Vibration Test / Humidity-Temperature Test